Precision Laser Wire Drawing Die Punching Machine

Precision Laser Wire Drawing Die Punching Machine

Details
The invention relates to a wire drawing die punching machine special for a precision microwire, which is special equipment for processing ultra-fine metal wire dies, is suitable for severe use requirements of the microwire industry, has a minimum aperture of 0.005 mm, is mainly used for punching applications of natural diamond and monocrystalline diamond, and can meet the harsh requirements of high-end users on hole roundness, finish and the like
Category
Laser Wire Drawing Die Punching Machine
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Description
Technical Parameters

 

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Patented liner laser frequency conversion technology avoid the problem that the shape of hole cannot be controlled because of the center overburning, and realize the large angle compression zone.


Dedicated hole pattern of micro wire setting software, achieve at 9 segments angles setting at most, so that it can accomplish the complicated hole pattern design.

Natural marble structure can avoid the vibration , and also avoid the influence of work pieces consistency because of the temperature fluctuate.

 

 

 

 

Dedicated high precision rotary table and the motion structure will achieve 0.1μm precision control at highest.

Special design high beam quality M2<1.2 and stable variable frequency laser can satisfy the request of micropore.

 

 

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 Model

LCWG -S5 -532 - Z3

激光功率 laser power

8W

激光频率Laser frequency

100-5K

光斑直径Spot diameter

3μm

冷却方式Cooling mode

air cooling

电力要求 Power demand

单相single-phase AC220V/50Hz

设备功率 Equipment power

500W

整机重量 Whole machine weight

500KG

激光波长 Wavelength

532nm

定位观测系统 Positioning Observation System

激光同路成像显微镜 laser coaxial image microscope

环境要求 Environmental requirements

No vibration, no interference, Temp:25℃±5℃,humidity:<70%

无振动,无干扰源,温度25℃±5℃,湿度<70%

转台类型    Turntable type

Precision air floating turntable, speed continuously stepless adjustable

精密空气悬浮转台,转速连续无级可调

装卡方式    Card loading mode

Precision authentic imported three-jaw chuck or super precision fixed caliber lock ring chuck( special for  diamond die)

精密原装进口三爪卡盘或超精密固定口径锁环卡盘(金刚线模具专用)

尺寸   Size

 

80*80*170cm(长LWH)  

排尘功耗    Dust removal power consumption   

550W(高压涡轮式排风机,已随机器配备)(High pressure turbine exhaust fan is supplied with the machine)

工作台参数

 

Concentrated on developing the laser micro processing, especially on the precision laser punching industry.  Self-own research and develop laser wire drawing die punching machine series, which are applied in high-end metal wire drawing die industry, make the diamond die laser micro aperture production to international standard. Kinds of core patents had been obtained.

 

HBS will explore more laser application in precision processing and medical industry with our passion and profession

 


 




 

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