With the maturity and development of laser marking technology, laser marking has many new methods and new applications in recent years.
1 Shallow ditch marking. Shallow trench marking is the formation of shallow trench marks on the surface of the material. Marking too deep can cause damage to the surface of the material. For example, the depth of marking of integrated circuit IC packages must be controlled within a few micrometers. Laser marking methods are often used in place of marking machines and stamping machines.
2 Deep groove marking. Deep groove marking refers to the formation of a deep mark on the surface of a material, which is mainly used for the processing of metal materials. Frequently, a laser is used to melt the surface of the material, evaporate, or repeatedly scan the same part to form a deep trench. This method, which is laser normal use today, can replace the conventional etching process.
