There are two accepted principles of the laser marking machines:
The fist is “Hot working ”by laser marking machine
"Hot working" laser beam with a higher energy density, which is a concentrated energy flow, irradiates the surface of the material to be processed, absorbs the laser energy at the surface of the material, and generates a thermal excitation in the irradiated area so that the surface of the material Coating) temperature rise, resulting in abnormal, melting, ablation, evaporation and so on.
The second is “Hot working ” by laser marking machine
"Cold working" photons (UV) light with a high energy load that interrupts chemical bonds in materials (especially organic materials) or in the surrounding media to non-thermal process failure of the material. This type of cold working is of particular significance in laser marking because it is not thermal ablated but does not produce the "thermal damage" side effects that interrupt the cold stripping of the chemical bonds so that the inner and the vicinity of the surface being machined are not Produce heat or heat deformation and so on. For example, in the electronics industry, an excimer laser is used to deposit a thin film of a chemical material on a substrate material to form a narrow groove in the semiconductor substrate.
Know the Laser marking machine principle, you will know much about the marking machines.
