Ultraviolet laser marking machine is used for ultra-precision marking and engraving. It is especially suitable for applications such as food, pharmaceutical packaging materials marking, micro hole drilling, high-speed glass material division, and complex pattern cutting of silicon wafers.
The effect of the marking is to directly break the molecular chain of the material by the short-wavelength laser to reveal the desired etching pattern and text.
UV laser processing has become cold processing, because the high-energy molecules of the UV photons directly remove the molecules on the metal or non-metal materials that need to be processed. However, this separation leads to the separation of molecules from the material. This kind of work is not generated by heat. Since this does not produce heat, the UV laser process is a cold process, different from the traditional laser.
